News Bytes 20250407: Tariffs and the Technology Industry, Intel-TSMC Deal?, DARPA Taps Wafer Scale, Sandia and Laser-Based Cooling, Optical I/O News

Good April day to you! It was a wild week for more than the HPC-AI sector last week, here’s a brief (7:39) look at some key developments: U.S. tariffs, the technology sector and advanced chips, Intel-TSMC ….

DARPA Taps Cerebras and Ranovus for Military and Commercial Platform

AI compute company Cerebras Systems said it has been awarded a new contract from the Defense Advanced Research Projects Agency (DARPA) to develop a system combining their wafer scale technology with wafer scale co-packaged optics of Ottawa-based Ranovus to deliver ….