Good April day to you! It was a wild week for more than the HPC-AI sector last week, here’s a brief (7:39) look at some key developments:
– U.S. tariffs, the technology sector and the advanced chips arena
– Reports of an Intel-TSMC joint venture
– DARPA fuels wafer scale co-packaged optics via Cerebras and Ranovus
– Sandia Lab to test laser-based photonic cooling
– 8 Tbps optical UCIe chiplet for scale-up AI from Ayar Labs
– Lightmatter 3D co-packaged optics
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