Broadcom Delivers Industry Leading 200G/lane DSP for Gen AI Infrastructure

Broadcom Inc. (NASDAQ: AVGO) today announced the general availability of SianTM2, 200 Gbps per lane (200G/lane) PAM-4 DSP PHY. Sian2 features 200G/lane electrical and optical interfaces to augment the Sian DSP that supports 100 Gbps electrical and 200Gbps optical interfaces. Sian and Sian2 DSPs enable pluggable modules with 200G/lane interfaces that are foundational to connect next generation AI clusters.

How to Scale AI Infrastructure Effectively, Without Sacrificing Cost Efficiency

Read this white paper, “Investing in AI Infrastructure,” from our friends over at IDC and Supermicro that explores how to scale AI infrastructure effectively, without sacrificing cost efficiency.