https://orionx.net/wp-content/uploads/2025/03/100@HPCpodcast_ID_Dr-Ian-Cutress_State-of-AI-Advanced-Chips_20250312.mp3 Just before GTC (and for the 100th episode of the @HPCpodcast and this one sponsored by liquid cooling company CoolIT), we welcome special guest and high-powered chip industry analyst Dr. Ian Cutress, Chief Analyst at More Than Moore and host of the popular YouTube channel TechTechPotato to discuss the state of AI and […]
@HPCpodcast: Dr. Ian Cutress on the State of Advanced Chips, the GPU Landscape and AI Compute, Global Chip Manufacturing and GTC Expectations
March 13, 2025 by
Axelera AI Wins EuroHPC Grant of up to €61.6M for AI Chiplet Development
March 6, 2025 by
AI hardware maker Axelera AI has unveiled Titania, which the company described as a high-performance, low-power and scalable AI inference chiplet. Part of the EuroHPC Joint Undertaking’s effort to develop a ….
Fluidstack and Eclairion to Deliver 18K GPU Supercomputer in France
March 5, 2025 by
London-based AI cloud platform Fluidstack and Eclairion, a French maker of modular, high-density data centers, have partnered to build what the companies said is Europe’s largest GPU supercomputer that they will deliver in 2025 for Mistral AI ….
TSMC to Invest $100B in 3 New U.S. Fabs, Packaging, R&D
March 4, 2025 by
TSMC (TWSE: 2330, NYSE: TSM) today announced its intention to expand its investment in advanced semiconductor manufacturing in the United States by an additional $100 billion. Building on the company’s ongoing $65 billion investment in its advanced chip fabs in Phoenix, TSMC’s total investment in the U.S. is expected to reach US$165 billion. The expansion […]
d-Matrix Launches New Chiplet Connectivity Platform to Address Exploding Compute Demand for Generative AI
January 24, 2023 by
Today, d-Matrix, a leader in high-efficiency AI-compute and inference processors, announced Jayhawk, an Open Domain-Specific Architecture (ODSA) Bunch of Wires (BoW) based chiplet platform for energy efficient die-die connectivity over organic substrates. Building on the back of the Nighthawk chiplet platform launched in 2021, the 2nd generation Jayhawk silicon platform further builds the scale-out chiplet based inference compute platform. d-Matrix customers will be able to use the inference compute platforms to manage Generative AI applications and Large Language Model transformer applications with a 10-20X improvement in performance.
